Last month, rumors of a dual-chiplet or a dual chipset based motherboard design for AMD's Socket AM5 motherboards that will accommodate the next-gen Zen 4 Ryzen 7000 CPUs, started doing the rounds. More recent reports have also attested to this stating that such a design was indeed in the works.
Today, images of a Socket AM5 motherboard PCB blueprint showing what appears to be dual chipsets has leaked. The diagram belongs to an Asus PRIME X670-P WIFI model, and it also seems to confirm reports that the dual chipsets will not only be on the new flagship X670E chipset, but also on the familiar X670.
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You can view the PCB blueprint diagram of the Asus PRIME X670-P WIFI board below. The dual chipsets are indicated by the black circles pointed towards at by two white arrows. The chipset supplier is reportedly AMD's long-time partner ASMedia, but this has not been confirmed at the moment. It is also not known what kind of benefits and features this dual-chipset design will bring to AM5.
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The diagram also shows four DIMM DDR5 memory slots, an Asus logo, the AM5 LGA1718 socket itself, and a robust VRM phase design, among various other electronic components.
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